Electrolube Surface Mount Adhesive is a heat curable, one-part
thixotropic adhesive. It has high uncured green strength and a fast
cure cycle with medium bond strength.
Features- High 'green strength' - i.e. excellent 'stickiness' ensures
components do not move during handling before curing has taken
place.
- Thixotropic properties give high dot profile.
- Excellent mechanical strength.
- Not affected by UV light so that assembly operations can be
carried out in normal conditions of light.
- Resistant to PCB cleaning solvents.
- High dielectric strength.
- Long term stability after cure cycle.
- Fast cure at 120°C or longer cure at 90°C for component safety.
- Single part system.
- Flexible in cured state to ensure components are not stressed.
- Medium strength cured bond allows component removal for
rework.