DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit. This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.
FEATURES & BENEFITS- Thermal conductivity: > 1.8 W/m.K
- Room temperature cure or heat accelerated cure
- Long term performance stability during temperature cycling up to 150ºC
- Holds vertical position (cured or uncured state)
- UL 94 V-0 and CTI ≥ 600 certifications
- Glass Beads option (180 & 250 micron)