DOWSIL TC-4525 is a 2.5 W/m·K Silicone Gap Filler material for automotive applications, it is a two part room temperature curing material.
APPLICATIONS
- DOWSIL™ TC-4525 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.
- This material is specifically designed for a smooth assembly process line integration ideally
FEATURES & BENEFITS
- Thermal conductivity: 2.5 W/m·K
- Room temperature cure
- Long term performance stability during temperature cycling up to 150°C
- Withstand peak exposure at 200°C
- Holds vertical position (cured or uncured state)
- UL 94 V-0 certification
- Glass Beads option (180 micron)
- Control volatility option available