DOWSIL TC-4535 CV Thermally Conductive Gap Filler

Trenutno se nahajate: proizvodi> Kemično - tehnični proizvodi> Elektro-kemikalije> Proizvodi za odvajanje toplote> DOWSIL TC-4535 CV Thermally Conductive Gap Filler

Izberi izdelekDIATHERM Toplotno prevodni trakoviDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Toplotno prevodna epoksidna smolaELECTROLUBE ER2183 – Epoksidna toplotno prevodna smolaELECTROLUBE HTC – Brezsilikonska toplotno prevodna pastaELECTROLUBE HTCP – Brezsilikonska toplotno prevodna pasta PlusELECTROLUBE HTCPX - Brezsilikonska toplotno prevodna pasta Plus XtraELECTROLUBE HTCPX LV – Brezsilikonska nizkoviskozna toplotno prevodna pasta Plus XtraELECTROLUBE HTCX – Brezsilikonska toplotno prevodna pasta XtraELECTROLUBE HTS – Silikonska toplotno prevodna pastaELECTROLUBE HTSP – Silikonska toplotno prevodna pasta PlusELECTROLUBE TCOR – Toplotno prevoden silikonELECTROLUBE TPM350Materiali za odvajanje toplote

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DOWSIL TC-4535 CV THERMALLY CONDUCTIVE GAP FILLER

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DOWSIL TC-4535 CV Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from PCB module assemblies mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit.

Features/Properties:

• 3.5 W/m.K Silicone Gap Filler
• Room temperature cure or heat accelerated cure
• Long term performance stability during temperature cycling up to 150°C
• Holds vertical position in the assembly for long service period
• Controlled silicone volatility
• UL 94 V pending

Pdf:

• TDS DOWSIL TC 4535 CV Thermally Conductive Gap Filler eng.pdf