DOWSIL TC-5150 Thermally Conductive Gap Filler

Trenutno se nahajate: proizvodi> Kemično - tehnični proizvodi> Elektro-kemikalije> Proizvodi za odvajanje toplote> DOWSIL TC-5150 Thermally Conductive Gap Filler

Izberi izdelekDIATHERM Toplotno prevodni trakoviDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Toplotno prevodna epoksidna smolaELECTROLUBE ER2183 – Epoksidna toplotno prevodna smolaELECTROLUBE HTC – Brezsilikonska toplotno prevodna pastaELECTROLUBE HTCP – Brezsilikonska toplotno prevodna pasta PlusELECTROLUBE HTCPX - Brezsilikonska toplotno prevodna pasta Plus XtraELECTROLUBE HTCPX LV – Brezsilikonska nizkoviskozna toplotno prevodna pasta Plus XtraELECTROLUBE HTCX – Brezsilikonska toplotno prevodna pasta XtraELECTROLUBE HTS – Silikonska toplotno prevodna pastaELECTROLUBE HTSP – Silikonska toplotno prevodna pasta PlusELECTROLUBE TCOR – Toplotno prevoden silikonELECTROLUBE TPM350Materiali za odvajanje toplote

EN AT DE CZ HU SI SK HR 

DOW

DOWSIL TC-5150 THERMALLY CONDUCTIVE GAP FILLER

Pošlji povpraševanje za ta izdelek!

DOWSIL  TC-5150 Thermally Conductive Gap Filler is a high performance, one-part, non- curable, dispensable thermally conductive gap filler with 5 W/mK thermal conductivity, and like other Dow  thermally conductive compounds, is made with silicone materials heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity and high temperature stability. 

The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device to the heat sink or chassis, thereby increasing the overall efficiency of the device.

Applications:

• On board chargers
• Central processing units (CPUs)
• Memory and power modules
• Telecom base stations
• Automotive Electronic Control Units (ECU)
• Processors & Microprocessors
• Power Electronics
• Power supplies and semiconductors

Benefits:

• High thermal conductivity
• Easy to dispense
• Form-in-place
• No additional curing process required
• Low thermal impedance
• Reworkable
• Room temperature storage

Pdf:

• TDS DOWSIL TC 5150 Thermally Conductive Gap Filler eng.pdf