DOWSIL TC-6010 Thermally Conductive Encapsulant

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Izberi izdelekDIATHERM Toplotno prevodni trakoviDOWSIL TC-3065 Thermal GelDOWSIL TC-4040 Dispensable Thermal PadDOWSIL TC-4515 Thermally Conductive Gap FillerDOWSIL TC-4525 Thermally Conductive Gap FillerDOWSIL TC-4535 CV Thermally Conductive Gap FillerDOWSIL TC-5150 Thermally Conductive Gap FillerDOWSIL TC-5550 Thermal Conductive Compound DOWSIL TC-6010 Thermally Conductive EncapsulantELECTROLUBE ER2074 – Toplotno prevodna epoksidna smolaELECTROLUBE ER2183 – Epoksidna toplotno prevodna smolaELECTROLUBE HTC – Brezsilikonska toplotno prevodna pastaELECTROLUBE HTCP – Brezsilikonska toplotno prevodna pasta PlusELECTROLUBE HTCPX - Brezsilikonska toplotno prevodna pasta Plus XtraELECTROLUBE HTCPX LV – Brezsilikonska nizkoviskozna toplotno prevodna pasta Plus XtraELECTROLUBE HTCX – Brezsilikonska toplotno prevodna pasta XtraELECTROLUBE HTS – Silikonska toplotno prevodna pastaELECTROLUBE HTSP – Silikonska toplotno prevodna pasta PlusELECTROLUBE TCOR – Toplotno prevoden silikonELECTROLUBE TPM350Materiali za odvajanje toplote

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DOWSIL TC-6010 THERMALLY CONDUCTIVE ENCAPSULANT

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DOWSIL TC-6010 Thermally Conductive Encapsulant is a two-component silicone elastomer material. It is designed especially for use in the manufacture of electrical and PCB system assembly products and modules. DOWSIL TC 6010 cures with heat to form elastic, thermally conductive rubber.

Key benefits:

• Lower viscosity for impregnation and its flowability
• Less filler caking and easy re-homogenous
• Thermal Conductivity ≤1.2 W/m∙K
• UL 94 V-0 Flammability
• Low volatile content (D4-D10) <100ppm (0.01%)

Pdf:

• TDS DOWSIL TC 6010 Thermally Conductive Encapsulant eng.pdf