Three Bond 2217L SMT lepilo

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THREE BOND 2217L SMT LEPILO

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Three Bond 2217L is one-component epoxy resin, which has been specially developed for surface mounting, in order to keep the components in position on the printed circuit boards during the placement and the soldering process. This SMD adhesive (Surface Mount Adhesive) excels in fast application methods and reduced curing times and ensure a perfect safety of the process.

Features

• The simple application by means of automatic dispensers and screen printers allows a faster placement.
• The fast curing of the resins at low temperatures (80°C ~) enables shorter processing times (example 150°C x 1 ~ 5 min).
• As the resins contain more than 99 % of nonvolatile matters, there is only a minimal shrinkage and outgassing while curing.
• The cured resins excel in excellent electric properties as well as in good chemical and thermal resistance.
• Perfectly suited as Chip-Bonder for Quad Flat Package (QFP).

Typical Properties:

• Colour: Red
• Viscosity at 25 °C: 154 Pa.s
• Curing time at 80 °C: 200 - 230 s
• Glass transition temperature: 99 °C
• CTE1: 77 ppm/°C

Pdf:

• TDS Three Bond 2217L eng.pdf