Three Bond 2274 SMT lepilo

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THREE BOND 2274 SMT LEPILO

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The product Three Bond 2274 is a one-component epoxy resin which has been specially developed for surface mounting, in order to keep the components in position on the printed circuit boards during the placement and the soldering process. This SMD adhesive (Surface Mount Adhesive) excels in fast application methods and reduced curing times and ensures a perfect safety of the process. Due to its low glass transition temperature (Tg), component parts having been potted beforehand, can be easily repaired or removed.

Features:

• The simple application by means of automatic dispensers and screen printers allows a faster placement.
• The fast curing of the resin at low temperatures enables shorter processing times.
• As the resin contains more than 99 % of nonvolatile matters, there is only a minimal shrinkage and outgassing while curing.
• The cured resin excels in excellent electric properties as well as in good chemical and thermal resistance.
• Perfectly suited as repairable Underfiller for Quad Flat Package (QFP), Ball Grid Array Packages (BGA) and Chip Size Package (CSP)

Typical Properties:

• Colour: Black
• Viscosity at 25 °C: 12 Pa.s
• Curing time at 60 °C: 180 min
• Glass transition temperature: 65 °C
• CTE1: 54 ppm/°C

Pdf:

• TDS Three Bond 2274 eng.pdf