ThreeBond 2271G

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THREEBOND 2271G

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Three Bond 2271G is an one-component epoxy resin, which has been specially developed to provide Non Conductive Paste for Flip Chip bonding process.

Features:

• Fast cure (for example 190°C x 5 sec)
• Low viscosity for easy dispensing (15 Pa·s)
• Low coefficient of thermal expansion

Typical Properties:

• Colour: Light Yellow
• Viscosity at 25 °C: 15 Pa.s
• Curing time at 190 °C: 5s
• Young´s modulus: 4,3 GPa
• Glass transition temperature: 103 °C
• CTE1: 52 ppm/°C
• Volume resistivity: 2.0x10¹⁴ ohm.m
• Dielectric constant at 1MHz: 3.4

Pdf:

• TDS ThreeBond 2271G eng.pdf