DOWSIL™ EE-1010 Low Viscosity Encapsulant Kit Suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step.
Features & Benefits
- Long working time
- Room temperature cure or accelerated heat cure
- High hardness/durometer compared to other PCB system assemblies encapsulants
- Moderate thermal conductivity
- Different colors for Part A and Part B for easy identification of mixing
- In complex geometries, low viscosity enhances flow and fill in narrow spaces and long working time enables air displacement
- Rapid, versatile cure processing controlled by temperature
Composition
- Two-part
- 1 to 1 mix ratio
- Polydimethylsiloxane silicone elastomer
Applications- DOWSIL™ EE-1010 Low Viscosity Encapsulant is suitable for use in applications where there are frequent start/stops during the manufacturing process or where board and component complexity require more time for entrapped air to be displaced, rise to the surface, and break without requiring a vacuum de-airing step
- Material can be dispensed manually or through meter mixing
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